EB13E2H2H-33.333M TR 数据手册
EB13E2 Series
REGULATORY COMPLIANCE
2011/65 +
2015/863
191 SVHC
ITEM DESCRIPTION
Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 2.5mm x 3.2mm Ceramic Surface Mount (SMD)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
1.024MHz to 66.6666MHz
Frequency Tolerance/Stability
Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the Operating Temperature Range,
Supply Voltage Change, Output Load Change, First Year Aging at 25°C, Shock, and Vibration
±100ppm Maximum over -20°C to +70°C
±50ppm Maximum over -20°C to +70°C
±25ppm Maximum over -20°C to +70°C
±20ppm Maximum over -20°C to +70°C
±100ppm Maximum over -40°C to +85°C
±50ppm Maximum over -40°C to +85°C
±25ppm Maximum over -40°C to +85°C
±20ppm Maximum over -40°C to +85°C
3.3Vdc ±5%
Supply Voltage
Input Current
Load Drive Capability
3mA Maximum over Nominal Frequency of 1.024MHz to 9.999999MHz
4mA Maximum over Nominal Frequency of 10MHz to 19.999999MHz
5mA Maximum over Nominal Frequency of 20MHz to 39.999999MHz
6mA Maximum over Nominal Frequency of 40MHz to 50MHz
9mA Maximum over Nominal Frequency of 50.000001MHz to 66.6666MHz
IOH = -4mA
90% of Vdd Minimum
IOL = +4mA
10% of Vdd Maximum
Measured at 20% to 80% of waveform
5nSec Maximum over Nominal Frequency of 1.024MHz to 24MHz
4nSec Maximum over Nominal Frequency of 24.000001MHz to 50MHz
3nSec Maximum over Nominal Frequency of 50.000001MHz to 66.6666MHz
Measured at 50% of Waveform
50 ±5(%)
15pF Maximum
Output Logic Type
CMOS
Logic Control / Additional Output
Tri-State (High Impedance)
Tri-State Input Voltage (Vih and Vil)
80% of Vdd Minimum or No Connect to Enable Output, 20% of Vdd Maximum to Disable Output (High Impedance)
Standby Current
Start Up Time
Disabled Output: High Impedance
10µA Maximum
Fj = 12kHz to 20MHz
1pSec Maximum
10mSec Maximum
Storage Temperature Range
-55°C to +125°C
Output Voltage Logic High (VOh)
Output Voltage Logic Low (VOl)
Rise/Fall Time
Duty Cycle
RMS Phase Jitter
Revised O: 12/5/2014
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EB13E2 Series
PART NUMBERING GUIDE
Revised O: 12/5/2014
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EB13E2 Series
MECHANICAL DIMENSIONS
SUGGESTED SOLDER PAD LAYOUT
PIN
1
CONNECTION
Tri-State
2
Case/Ground
3
Output
4
Supply Voltage
All Tolerances are ±0.1
All Dimensions in Millimeters
Revised O: 12/5/2014
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EB13E2 Series
OUTPUT WAVEFORM & TIMING DIAGRAM
Revised O: 12/5/2014
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EB13E2 Series
TEST CIRCUIT FOR CMOS OUTPUT
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency ceramic bypass
Capacitor close to the package ground and VDD pin is required.
Note 2: A low input capacitance (10Mohms), and High bandwidth (>300MHz)
Passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet for ‘Load Drive
Capability’.
Revised O: 12/5/2014
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EB13E2 Series
TAPE & REEL DIMENSIONS
Quantity per Reel: 1000 Units
All Dimensions in Millimeters
Compliant to EIA-481
Revised O: 12/5/2014
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EB13E2 Series
RECOMMENDED SOLDER REFLOW METHOD
HIGH TEMPERATURE INFRARED/CONVECTION
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum(TS MAX)
- Time (tS)
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
3°C/Second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/Second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
Target Peak Temperature(TP Target)
250°C +0/-5°C
Time within 5°C of actual peak (tp)
20 - 40 Seconds
Ramp-down Rate
6°C/Second Maximum
Time 25°C to Peak Temperature (t)
8 Minutes Maximum
Moisture Sensitivity Level
Level 1
Additional Notes
Temperatures shown are applied to body of device.
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
Revised O: 12/5/2014
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EB13E2 Series
RECOMMENDED SOLDER REFLOW METHOD
LOW TEMPERATURE INFRARED/CONVECTION
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (Ts MIN)
- Temperature Typical (Ts TYP)
- Temperature Maximum(Ts MAX)
- Time (ts)
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
5°C/Second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/Second Maximum
150°C
200 Seconds Maximum
240°C Maximum
Target Peak Temperature (TP Target)
240°C Maximum 2 Times / 230˚C Maximum 1 Time
Time within 5°C of actual peak (tp)
10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time
Ramp-down Rate
5°C/Second Maximum
Time 25°C to Peak Temperature (t)
N/A
Moisture Sensitivity Level
Level 1
Additional Notes
Temperatures shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
Revised O: 12/5/2014
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EB13E2H2H-33.333M TR 价格&库存
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